Active and passive optical solutions for interconnection of optical fibres of the future
When designing applications that utilize high-speed interconnects, it is vital to navigate around all potential speed bumps along the signals path. Factors such as stack ups, tolerances, via design, trace widths, plating and copper etching will have to be understood and mastered to achieve an optimal signal path. Any design checklist should also include the connector with matching cable.
Mid board optical systems
FireFly™ Micro Flyover System™ is a future-proof, inside-the-box mid-board optics interconnect solution, with performance to 28 Gbps per lane and a path to 56 Gbps. Designed for the interchangeability of copper and optical using the same high-performance connector set, this easy to assemble system improves signal integrity and increases signal path length to meet today’s data rate requirements and the next generation. With an industry leading miniature footprint, FireFly™ accommodates greater density and closer proximity to the IC for chip-to-chip, board-to-board, on-board and system-to-system connectivity.
Catalogues and brochures:
PCle systems
PCIe® active optical cable assemblies in x4 and x8 form factors with four independent, full-duplex optical channels to support Gen 3 data rates up to 100 meters. Features a fully integrated electrical to optical conversion engine available in full active optical cables with host and target, or half active optical cables with MTP end option.
Catalogues and brochures:
Passive optical systems
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Passive optical cable systems support high-density applications with MTP end options and a single or double port adaptor for mating. Cable assembly available in 12 or 14 fibres and keying options on the adaptor for proper alignment.
